Centre For Development Of Advanced Computing

Centre For Development Of Advanced Computing has published Supply Of Risc-V Based Asic S-Asic In 28Nm Tsmc Hpc Process. Supply Of Risc-V Based Asic S-Asic In 28Nm Tsmc Hpc Process , Fee Component For Executing The Project And Services ( Ff ) , Mpw Cost For Fabrication Of Dies In Tsmc28nm Hpc+ Process For Flip-Chip Based Die Area Of 30Mm2, And Delivery Of A. 900 Chipsin Typical Corner B. 50 Chips In Fast Corner C. 50 Chips In Slow Corner , Hsbga 676 Packaging Cost For Flip-Chip Based Asic Die Area Of 30Mm2.. Last date of submission for this tender is 2022-03-10. This is a Machine Tools tender in Trivandrum, Kerala