Centre For Development Of Advanced Computing

Centre For Development Of Advanced Computing has published Supply Of Vega Processor Based Packaged Chips Supply Of Vega Processor Based Packaged Chips , Fee Component For Executing The Project And Services ( Ff ) , Mpw Cost For Fabrication Of 100 Dies In Tsmc65nm Gp Process With Staggered Io For Die Area Of 14Mm2 Make: Tsmc , Bga324 Packaging Cost For Wirebond Staggered Io Based Asic With Die Area Of 14Mm2, And Delivery Of A. 100 Chips In Typical Corner Make:Tsmc , Additional Fabrication Cost For Extra 100 Dies Upto A Maximum Of 900 Dies Make:Tsmc , Additional Packaging Cost For Extra 100 Dies Upto A Maximum Of 900 Dies Make: Tsmc. Last date of submission for this tender is 2022-03-19. This is a Spare Part tender in Trivandrum, Kerala