Department Of Telecommunications

Department Of Telecommunications has published Bids Are Invited For Integrated Circuit Da3b2052740h6t2 , Da3b2392604j8t9 , Da3b2572601k1t2 , Da3b2522543s1t2 , Da3b2512603j9t9 , Da3c1142608s1ta , Da3b2052770h1t2 , Da3b2572605s3t9 , Da3b2432427e4t7 , Da3c1142575b4t2 , Sa3b2522805s4t2 , Sa3b2572857s2t2 , Sa3b2052851h1t2 , Sa3c1144300s4t2 Ic Ee-Prom 8Kbit 10 Mhz 8 Soic, Ic, Octal 3 State Non- Inverting Buffer, 3.3 V, 20 Pin,. Tssop Package, -40 To +125 Deg. C, Lead Free, Ic, Cmos, Micro Controller, 3.3 V, 208 Pin Lqfp Package (Sot459-1), -40 To +85 Deg. C, Ic Cmos 1 U Amp To 5.5V. 250Kbps, Rs232 Transmitter-Reciever 16Pin Ssop Pkg.Temp: -40 To +85 Degree, Ic, Cmos 3.3V Hex Inverter, 14 Pin Tssop Package (Sot402-1), -40 To +125 Deg. C, Low Drop, Positive Voltage Regulator, 3.3 V, Sot-223, Ic, Flash 256 Mb, 133 Mhz, -40 To +85 Deg. C, , Analog-Digital Circuits Development Platform Molded Case Circuit Breakers (Mccb) As Per Is / Iec Total Quantity : 2090. Last date of submission for this tender is 2025-01-25. This is a Printed Circuit Assemblies tender in Bengaluru Urban, Karnataka